Spirox launches fast TGV crack inspection system

What this means for your job search: Expect growing demand for engineers and technicians proficient in next-generation semiconductor packaging, especially those with expertise in optical inspection and glass core substrate technologies. Candidates should research advancements in panel-level packaging and related quality control systems to demonstrate relevant industry awareness in interviews. Semiconductor equipment supplier Spirox Corp (蔚華科技) has launched its first high-speed glass core substrate inspection system as it expands into next-generation packaging technologies, including panel-level packaging.The company’s new optical inspection system can detect microcracks and debris accumu